摘要
在透射电镜(TEM)下原位观察了,Ce—TZP陶瓷材料中裂纹扩展过程,发现其与一些金属中裂纹扩展过程较相似,先在主裂纹前端形核微裂纹、微裂纹长大、然后主裂纹与微裂纹连接向前扩展。在裂尖应力场的作用下,裂尖附近有部分四方相发生马氏体相变,增加了材料的断裂韧性。同时还观察到裂纹弯曲和转向。实验还发现在该材料中主裂纹尖端并不尖锐,而为钝裂纹。
Crack propagating process in a Ce-TZP ceramics was in-situ observeed in TEM. It was found that the crack propagating process in this ceramics, similar to that in some metal materials, was microcrack nucleation ahead of main crack tip, microcrack growth, then main crack connecting with the micro one and propagating forward. The martensitic transformation of zirconia, induced by crack tip stress field, was observed in the vicinity of crack. Crack deflection was also observed in the ceramics. It was also found that the main crack tip was not sharp, it was a blunted crack.
出处
《北京科技大学学报》
EI
CAS
CSCD
北大核心
1993年第3期272-275,共4页
Journal of University of Science and Technology Beijing
基金
中国博士后科学基金
关键词
TZP陶瓷
裂纹扩展
透射电镜
TZP ceramics, crack propagation, in-situ observation transformation toughening
