摘要
MLCC制成小容量规格相对困难,且偶有破碎,可靠性差,用于制成圆片瓷介电容器的单层被银瓷片制成片式高压瓷介电容器以替代小容量的MLCC。开发设计了陶瓷芯片夹于上下两连体扁平引线中间并焊接后,再模塑环氧树脂封装,然后分割切开连体引线,使切开后的扁平引线平贴在外壳表面,得到了仍是用单层被银瓷片制成的片形高压瓷介电容器。该产品的小容量规格制造更容易,其可靠性高,适用于SMT。
It is relatively difficult to manufacture small capacitance MLCC, and this kind of products is fragile occasionally, and it has poor reliability, so hope to make chip high voltage ceramic capacitors that made from single layer ceramic discs with silver electrode which are also the main part of disk ceramic capacitors to replace small capacitance MLCC. First, place ceramic discs between the terminals of two tapes of joint-body leads, let them soldered, then mold the ceramic discs and the terminals with epoxy resin. Secondly cut the body of the joint-body leads separately, let the cut leads attach the surface of molded body, then get chip shape high voltage ceramic capacitors. These products with small capacitance can be made more easily, and the products have excellent reliability, they can be used in SMT manufacture field.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第6期10-11,13,共3页
Electronic Components And Materials
