摘要
基于倒谱分析的基本原理,认为倒谱反映的是信号和信号延迟之间的内在联系,可应用于粗糙表面轮廓的相关性分析。通过对几种典型机械加工试件测试和倒谱分析,并与以往的统计自相关函数描述方法比较后表明,倒谱同样可以用于随机过程表面的相关性分析,而且能非常容易地判别相关长度,相关性分析的灵敏度比自相关函数高。
Rough surface topography influences a certain
number of tribological phenomena like contact pressure, ad-
herence, friction, wear and lubrication. Therefore it is very im-
portant to describe the character of rough surface profile. The
cepstrum analysis is a new signal processing technique in recent
years, and is widely applied to analyse the signal and its echo in
the areas of earthquake, speech recognition, acoustics et al. A
cepstrum-based analysis method is presented for the
auto-correlation of rough surface profile. Some experiments of
cepstrum analysis on a few kinds of representative machining
specimens are made. The results show that the method based on
cepstrum can be used to analyse the auto-correlation of random
surface profile effectively and its analysis sensitivity is superior
to the conventional auto-correlation function. Furthermore this
method has the advantage of identifying the correlation length
of the profile exactly and reasonably.
出处
《机械工程学报》
EI
CAS
CSCD
北大核心
2004年第5期87-91,共5页
Journal of Mechanical Engineering
关键词
表面粗糙度
倒谱分析
自相关函数
Roughness
Cepstrum analysis
Auto-correlation function
