摘要
钨粉是一种难加工、密度较大的材料 ,在其表面镀一层铜有利于改进其加工性能。介绍了钨粉化学镀铜工艺研究的试验结果 ,反应条件为镀液温度 70℃ ,用氢氧化钠调节溶液pH值为 11～ 13,并且在强烈电动搅拌下进行 ;镀液由硫酸铜、乙二胺四乙酸二钠、甲醛等组成 ,并对还原剂的选择、各试剂的用量、钝化剂的效果等进行了试验 ,结果表明甲醛是理想的还原剂 ,苯骈三氮唑对钨粉镀铜层有良好的钝化作用。此工艺可以一次完成 5 0 0g钨粉镀铜 ,镀铜钨粉在经过长时间放置表面未发生颜色变化 ,满足钨粉的加工需要。
Tungsten powder is a kind of higher density material and hard to process, plating copper can improve its processing performance. Electroless copper plating on the tungsten powder was introduced that plating bath was composed of copper sulfate (CuSO_4), Na_2EDTA, formaldehyde (HCHO) with pH value 11～13, and plating temperature was 70 ℃. The bath was strongly stirred with an electromotive stirrer. Choice of reducer, contents of ingredients and effect of passivant were also studied. Results show that formaldehyde is an ideal reducer, and 3N benzotriazole has better passivation effect on copper plating. The technology can achieve copper plating on 500 g tungsten powder at a time, and the surface color of copper plated tungsten powder will no change for a long time laying, which can meet the needs of tungsten powder processing.
出处
《材料保护》
CAS
CSCD
北大核心
2004年第5期22-23,共2页
Materials Protection
基金
中国工程物理研究院科学技术基金资助项目( 2 0 0 3 0 5 48)
关键词
钨粉
化学镀铜
工艺
tungsten powder
electroless copper plating
process
