摘要
利用金相和电子探针研究了Cu 16%Sn 8%P合金的微观结构,热处理条件对合金结构和硬度的影响。结果表明:在Cu 16%Sn 8%P合金中,P主要以Cu3P化合物形式存在,在Sn的影响下该化合物形成非常圆整的球状;Sn以Cu10Sn和Cu5Sn两种化合物存在。在560℃下保温,时间越长淬火组织中形成的条状Cu3P化合物越多,球状Cu3P化合物直径越小;硬度先降低,然后大幅度升高。对淬火组织进行退火处理,可进一步促进Cu3P化合物以块状、条状形态析出。
The microstructures of Cu-Sn-P alloy and the effect of the characters of its heat treatment on its microstructures and rigidity were investigated in this paper. Experimental results show that, it is hard for P to combine with Sn in Cu-Sn-P alloy, and existed in the form of round compound Cu_3P with the effect of the addition of Sn. There are two forms of compound Sn, i.e. Cu_(10)Sn and Cu_5Sn. Heat treatment process has great effect on the microstructures and rigidity of Cu-Sn-P alloy. The longer the samples preserved under 560℃ in the furnace, the more compound Cu_3P formed in the base in the form of strip, and the diameter of compound Cu_3P become shorter; as far as its rigidity, firstly, it reduces, then it has greatly increased. In addition, anneal makes great help to the compound Cu_3P to separate out in the form of block and strip.
出处
《铸造》
CAS
CSCD
北大核心
2004年第5期354-357,共4页
Foundry
基金
国家自然科学基金资助项目(50171037)。
