摘要
采用Cu作为中间层进行了Ti的真空接触反应钎焊,接头在SEM扫描电镜和光学显微镜下进行微观分析。研究结果表明,Ti/Cu/Ti接触反应钎焊是一个非常剧烈的过程,在900℃、180 s的参数下反应层宽度已达到毫米级。反应区中从Ti侧到Cu侧,微观组织依次为β-Ti(Cu)固溶体、Ti-Cu化合物、Cu(Ti)固溶体。同时发现同一条件下的上、下侧反应区与母材界面形貌各异,分别为直线状和弯曲状。断裂主要发生在Ti侧β-Ti(Cu)固溶体区。
The Ti contact reactive brazing with Cu as interlayer has been studied, and the microstructure of the joint is analyzed by scanning electronic microscopy(SEM,JSM-6300) equipped with energy disperse spectrum (EDS, JXA-840A) and electron microscope. The results show that the contact reactive brazing of Ti/Cu/Ti is a very rapid process, the thickness of the liquid phase zone reaches millimeter level at 900℃ for 180 s. From Ti side to Cu side in the reaction zone, the microstructures are β-Ti(Cu)solid solution,Ti-Cu compound and Cu(Ti)solid solution in turn. And it can be seen that the shapes of the two liquid phase zones with the base metals are different, they are linear-like and bending-like, respectively. The fracture occurred in β-Ti (Cu)solid solution zone near Ti base metal.
出处
《华东船舶工业学院学报》
2004年第2期56-60,共5页
Journal of East China Shipbuilding Institute(Natural Science Edition)
