摘要
利用x-线衍射、扫描电镜和透射电镜等手段对三种不同来源的SiC晶须的热稳定性进行了研究。实验发现SiC晶须在180℃以上显微结构发生变化,长径比减小。讨论变化机质及对复合陶瓷性能的影响。
The thermal stability of SiC whiskers from different sources are investigated by X-ray diffraction, SEM and TEM. It is found that the microstructure of SiC whiskers changed at temperatures higher than 1800℃, resulting in the reduction of the aspect ratio. The mechanism of this microstructure changed and it's influnce on the mechanical properties of ceramic composites are discussed.
出处
《中国科学院研究生院学报》
CAS
CSCD
1992年第3期318-323,共6页
Journal of the Graduate School of the Chinese Academy of Sciences
关键词
碳化硅
晶须
热稳定性
显微结构
SiC whiskers, thermal stability, microstructure
