摘要
为了研究TiO2在镀层中的光催化抗菌活性,以不锈钢为基体,制备了Ni/TiO2光催化抗菌功能性复合镀层,测定了镀层中TiO2微粒的复合量,考察了Ni/TiO2电极的光催化析氢性能,利用ESEM观察了镀层的表面形貌,并探讨了半导体TiO2光催化杀灭细菌的机理.研究表明:当镀层中TiO2复合量达到21 98%时,Ni/TiO2复合镀层对大肠杆菌、绿脓杆菌、粪链球菌和金黄色葡萄球菌的抗菌率均大于95%;在光照射下,Ni/TiO2电极阴极析氢反应的起始电位正移了约200mV.
In order to study the photocatalytic antibacterial activity of TiO_2 in the deposit, Ni/TiO_2 composite deposits with antibacterial activity were prepared on SUS304 stainless steel matrix. The content of TiO_2in the deposit was measured and the surface morphology was characterized by the ESEM. The antibacterial performance of (Ni/TiO_2) composites were tested.The results show that the antibacterial rates of samples are>95% against the growth of Escherichia coli, pseudomonas aeruginosa, streptococcus faecalis and Staphylococcus aureus. The curve of cathod polarization in 0.5 mol/L H_2SO_4 solution demonstrates that the initial potential for hydrogen evolution reaction is shifted 200 mV positively under light irradiation.
出处
《材料科学与工艺》
EI
CAS
CSCD
2004年第1期52-56,共5页
Materials Science and Technology
基金
教育部
天津大学
南开大学联合研究院资助项目.
