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稀土元素对Sn-9Zn合金润湿性的影响 被引量：55

Wetting properties of Sn-9Zn solder alloy with trace rare earth elements
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摘要 Zn的活泼性使Sn 9Zn无铅钎料的润湿性和抗氧化性很差,在Sn 9Zn合金中加入适量混合稀土元素(Ce,La)可以改善其润湿性能。分别在245,260和290℃通过润湿平衡实验对钎料的润湿性进行了研究,并对RA,RMA,R和WWR4种不同钎剂进行了比较。结果表明:在运用活性松香钎剂时,微量混合稀土元素可以显著提高Sn 9Zn合金润湿性;而提高钎焊温度也可以改善润湿性能。 The eutectic Sn9Zn alloy is one of the leadfree solder alloys at the present time. Since Zn is an active element in solder, the wetting and corrosion properties of Sn9Zn alloy are impaired. In order to improve the wetting behavior, trace rare earth elements were added into Sn9Zn alloy. The wetting balance tests were conducted in ambient air to reveal the wetting behavior. Several types of flux, i.e. RA, RMA, R and WWR, were used to study the wetting properties of the Sn9ZnRE alloy system at 245, 260 and 290 ℃, respectively. By using RA flux, the trace RE addition can improve the wetting behavior significantly and the increasing of the temperature can also improve the properties.
作者 于大全 赵杰 王来
机构地区 大连理工大学材料工程系
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2003年第4期1001-1004,共4页 The Chinese Journal of Nonferrous Metals
基金 大连市科委计划项目资助(大科计发[2001]145)
关键词 Sn-9Zn合金 润湿性 稀土 无铅钎料 lead-free solder rare earth element Sn-9Zn wettability
分类号 TG425 [金属学及工艺—焊接]
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参考文献12

  • 1[1]Lee N C. Lead-free soldering-where the world is going[J]. Advancing Microelectronics, 1999, 26: 29-35.
  • 2[2]Lee N C. Getting ready for lead-free solders[J]. Soldering Surf Mount Technol, 1997, 28: 65-68.
  • 3[3]Glazer J. Metallurgy of low temperature Pb-free solders for electronic assembly[J]. Int Mater Rev, 1995, 40: 65-92.
  • 4[4]Abtew M, Selvaduray G. Lead-free solders in microelectronics[J]. Materials Scince and Engineering, 2000, 27: 95-141.
  • 5[5]Anderson I E, Foley J C, Cook B A, et al. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability[J]. J Electon Mater, 2001, 30: 1050-1059.
  • 6[6]Vincent J H, Humpston G. Lead-free solders for electronic assembly[J]. GEC J Res, 1994, 11: 76-89.
  • 7[7]McCormack M, Jin S, Chen H S, et al. New lead-free Sn-Zn-In solder alloys[J]. J Electron Mater, 1994, 23: 687-690.
  • 8[8]Suganuma K, Murata T, Noguchi H, et al. Heat resistance of Sn-9Zn solder/Cu interface with or without coating[J]. J Mater Res, 2000, 15: 884-891.
  • 9[9]Suganuma K, Niihara K, Shoutaku T, et al. Wetting and interface microstructure between Sn-Zn binary alloys and Cu[J]. J Mater Res, 1998, 13: 2859-82865.
  • 10[10]Loomans M E, Vaynman S, Ghosh G, et al. Investigation of multi-component lead-free solders[J]. J Electon Mater, 1994, 23: 741-746.

同被引文献709

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中国有色金属学报
2003年 第4期

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