摘要
提出了一种新型焊接工艺——预置中间层的相变超塑性焊接工艺(TSBI),工艺要求在待焊母材间预置入中间层材料;在循环加热时,峰值温度须同时大于母材的相变温度及中间层的液相线,实验以低碳钢为母材,以镍基非晶为中间层,实验规范为:峰值温度1050℃,下限温度400℃,压力18 MPa,循环次数15次,接头的拉伸性能及组织测试表明,新工艺具有界面无残留空洞、焊合率高、循环次数少、生产率高、接头强度高且稳定、对循环次数不敏感等优点,同时TSBI工艺的接头组织获得了跨越界面的共同晶粒,近缝区组织以细小的块状铁素体为主,但有少量魏氏组织。
A new welding process of transformation superplastic diffusion bonding with interlayer (TSBI) is proposed, which is different from conventional transformation superplastic bonding (TSB) in the following: the TSBI process must be required to placed interlayer (such as amorphous foil) previously; the maximum temperature of thermal cycles must be higher than the liquidus of the interlayer and the transformation temperature of the base metal. The experiment of the new TSBI process is carried out to determine its merits and mechanisms using low carbon steel as base metal and Ni-base amorphous foil filler metal as interlayer. The process parameters are that the maximum temperature is 1050degreesC, the minimum temperature 400degreesC, the pressure 18 MPa and the number of temperature cycling 15. The evaluation on joints by using metallography and tensile testing shows that using TSBI process there is no remained voids at the interface, so the bonded ratio can be increased greatly and the number of temperature cycling decreased; the joint has high strongth and is not sensitive to the number of temperature cycling. The microstructure of bonded zone at room temperature is consisted of fine ferrite and a few Widmanstatten structures.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
2003年第6期655-660,共6页
Acta Metallurgica Sinica
基金
西安交通大学科研基金23004
关键词
相变超塑性扩散焊接
中间层
低碳钢
transformation superplastic diffusion bonding
interlayer
low carbon steel
