摘要
对近 2 0年来低压电器用铜基电接触材料方面的专利进行了归纳整理 ,对专利中材料的设计思想 ,特别是与银基电接触材料设计思想的差别进行了分析。同时 ,对专利实施有可能对材料科学和材料加工领域整体技术进步的促进进行了展望。
Some patents about silver-free copper based electrical contact materials that were used in low-voltage apparatus in 20 years were listed here to give a convenient consultation to related researchers. Rules, which were concerned in design of these patent materials, especially the difference between them and those silver-based materials, were discussed. And the possibility to promote the comprehensive technical progress in aspect of material science research and material processing techniques development by implement of these patents were also predicted at the same time.
出处
《低压电器》
2003年第4期3-7,39,共6页
Low Voltage Apparatus
