摘要
介绍了最近几年在热电半导体材料领域里新出现的half-Heusler化合物的结构和研 究现状,比较了各化合物掺杂及等电子合金化前后的电与热传输参数的变化,并指出了该材料 的进一步研究方向.
This paper presented the introduction of new thermoelectric materials with half-Heusler structure. The crystal structure and recent progress were demonstrated. The effects of doping and isoelectronic alloying on thermoelectric properties were discussed. Some problems that should be paid great attentions to were given.
出处
《无机材料学报》
SCIE
EI
CAS
CSCD
北大核心
2004年第1期25-30,共6页
Journal of Inorganic Materials
基金
国家"863计划"(2001AA323070)
