摘要
高压集成电路和智能功率集成电路是电力集成电路(power IC)的重要分支。高压集成电路是将高压器件和低压控制电路集成在同一芯片上的集成电路。高压集成电路的出现,大大简化了功率电路,使其重量、价格、体积大大减小,它可以应用到宇航、工业和日用消费品,如电信、信号处理、遥控、显示驱动、手提式计算机、空调以及汽车等领域。高压集成电路的研究与发展,归功于高压器件、高压集成电路工艺以及设计技术的发展。最近几年,高压集成技术发展迅速。本文主要介绍高压集成电路目前所采用的各种器件结构、隔离技术以及工艺和设计技术。
High voltage integrated circuits(HVIC)and smart power ICs are an important branch of power ICs. HVICs have found application in aerospace, industry and consumer clet-ronics. They greatly simplify power circuits and reduce their weight, cost and volume. The research and development of HVICs arc dependent on the advance of the process and design technologies for HVICs, in which great progress have been made in recent years. In this paper, various device structures, isolation techniques, process and design technologies used for HVICs are introduced.
出处
《微电子学》
CAS
CSCD
1992年第3期29-38,54,共11页
Microelectronics
关键词
高压
集成电路
高压器件
隔离技术
HVIC, Power IC, High voltage device, Isolation technique
