摘要
精确测量热激励微梁(悬臂梁和桥)谐振器的厚度和残余应变对研究其谐振特性具有重要意义。由于组成谐振器的薄膜厚度远小于占优层厚度,本文首先利用单层梁谐振频率推算得梁的厚度的近似值,从而得到热激励梁的等效杨氏模量和等效密度。在此基础上利用双层梁谐振频率精确推算梁的厚度和残余应变,结果与测量值符合较好。该方法具有非破坏性的优点。
Measuring the thickness and residual strain of thermally excited microbeam resonators is important for studying their resonant characters. The thickness of microbeams was first calculated approximately by single layer beam model because the film of thermal excited microbeam resonators is far thinner than the dominant layer. With this approximate value the equivalent Young's modulus and equivalent density of thermal excited beams were obtained. Then the thickness and residual strain of a microcantilever or microbridge resonators were calculated by bilayer beam' resonance frequency. The calculated results are coincident with the experimental value. This method has the advantages of nondestructive.
出处
《电子器件》
CAS
2003年第4期329-333,共5页
Chinese Journal of Electron Devices
基金
国家自然科学基金(60036016
50077016)
教育部博士点基金(98069828)资助课题
关键词
微悬臂梁
微桥
谐振器
残余应变
microcantilever
microbridge
resonator
residual strain
