摘要
研究了β区淬火时效的TC4合金在400℃和600℃的应力松弛行为,并对应力松弛曲线进行拟合;微观组织观察结合宏观热变形参数分析表明:400℃应力松弛机制为位错滑移和孪晶及晶界、相界的运动,孪晶为(10-11)类型;600℃位错塞积成为亚晶界,应力松弛变形机制为位错滑移、攀移和原子扩散。
Bending stress relaxation at 400°C and 600°C were performed on Ti-6Vi-4V alloy. And TEM microstructural analysis for specimen before and after stress relaxation was performed. The stress relaxation curves were fitted with delay function. Microstructural analysis and macroscopic hot deformation parameters showed that the stress relaxation deformation mechanism at 400°C are dislocation glide and movements of twin, grain boundary or phase interface, while dislocation glide, climb and atom's diffusion at 600°C.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2003年第10期803-806,共4页
Rare Metal Materials and Engineering
