摘要
对CPU的Cu-Al散热片进行了数值模拟热分析,研究了在室温、强迫对流的条件下的温度分布及散热片材料和几何尺寸对其传热性能的影响,并计算出模块较佳的材料和尺寸参数。有限元数值模拟分析值与实验测试值的比较结果表明,采用有限元热分析技术对CPU散热片进行数值模拟是可行的,为CPU散热片的设计提供了有效的方法。
The numerical analysis of heat transfer in the Cu-Al ribbed radiator of CPU is completed in this paper. The temperature distribution of the radiator in the condition of the room temperature, forced convection and influence of the radiator material, and size on heat transfer are studied. The optimal material and size of radiator are computed. The results of comparison between the numerical values of finite element simulation analysis and experimental data show that the finite element simulation of heat transfer in CPU ribbed radiator is feasible, and an effective method is provided for design of CPU ribbed radiator.
出处
《计算力学学报》
EI
CAS
CSCD
北大核心
2003年第6期725-729,共5页
Chinese Journal of Computational Mechanics
基金
国家自然科学基金重点项目(10032030)资助项目.
关键词
CPU散热片
温度场模拟
强迫对流
传热性能
有限元分析
计算机科学
Aluminum copper alloys
Finite element method
Forced convection
Heat transfer
Microprocessor chips
Radiators
