摘要
针对在线路板生产过程中,线路板表面的离子污染值(IonicContaminationValue)较高,不能满足现代线路板生产的要求。研究了降低表面污染值的方法,通过试验对溶液组成、阳极组成及操作条件等工艺参数进行优化,并采用OmegaConductometer和X-ray能谱分析等方法对表面的变化情况进行测试和评价。结果表明,通过降低镀液中Pb2+浓度,增加阳极中Sn的比率,并提高水洗温度后的工艺能满足实际生产的需要。
Owing to the Ionic Contamination (IC) Value on the PCB surface is often higher, it can't meet the requirements of modern PCB production. It is essential to study the feasible methods to reduce the IC value on PCB surface during some of the PCB process. By two measures taken and analysis the data recorded by X-ray instrument and Omega Conductometer, better operational parameter can be gained from the experiments. Experiment shows these parameters can meet the need of industrialization.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2003年第6期38-39,50,共3页
Surface Technology
