摘要
目的 观察半导体激光局部照射的方法对减轻正畸治疗中疼痛的临床效果。方法 对戴入初始弓丝的128例正畸患者,其中63例患者应用半导体激光照射其受力前后的牙根部区域,照射次数1～2次。余65例患者作为对照组。通过问卷调查了解疼痛发生的时间、持续时间并进行统计学分析。结果 应用半导体激光照射组疼痛的发生时间迟,疼痛持续时间短。对照组疼痛发生率为96.92％,照射组疼痛发生率为79.37％。结论 半导体激光局部照射对减轻正畸伴发的疼痛有效。
Objective This clinical observation was to investigate the effects of semiconductor laser irradiation in reducing the
pain in orthodontic treatment. Methods 128 patients were inserted with initial wire. 63 of them were irradiated to the anterior
and posterior teeth area for one or two times by semiconductor laser. Other patients were in control group. The times that pain oc-
curring and lasting were recorded by filling in a form. The results were statistically anlysized. Results The time that the pain oc-
curred was delayed and the time that it lasted was shorten. The occurrence of pain is 96. 92% in control group. 79. 37% in irra-
diated group respectively. Conclusion The semiconductor laser irradiation is effective to reduce the pain in the orthodontic treat-
ment.
出处
《广东牙病防治》
2003年第4期249-250,共2页
Journal of Dental Prevention and Treatment
