摘要
选用无规聚合物为HM—G热熔密封胶的基本材料,与天然树脂等混合,试制出适用于医用微电子设备的组装材料之一——HM—G热熔密封肢,并研究了共混HM—G热熔胶的工艺、性能和组成的关系。经应用及检测结果表明:HM—G热熔密封胶与组装材料有良好的粘接性能,达到了设备要求的技术指标。
This product choose random polymeride as the basic material that mixed with the natural resin etc. It is suitable the clinical micromodule. This paper also studied the ralations of performance, process and composition of the HM—G heat meal seal adhesive. The test showed that the HM—G heat melt adhesive had well cohesiveness to the substrate and meeted the technology standards of the equipment.
