摘要
用束径0 4μm的微束重离子数值模拟了单粒子翻转SEU和单粒子烧毁效应SEB.单粒子翻转给出了不同离子注入后漏区的电压(电流)随时间变化规律;计算了CMOSSRAM电路的单粒子翻转;给出了收集电荷随LET值的变化曲线并给出了某一结构器件的临界电荷;VDMOS器件单粒子烧毁给出了不同时刻沿离子径迹场强、电位线、电流和碰撞离化率的变化.
Effects of SEU and SEB are simulated with 04?μm diameter microbeam. SEU for drain region of MOSFET and CMOS SRAM are calculated. Collective charge depending on LET for specific device structure is calculated for different ions. LET and critical charge are provided. SEB for VDMOS is simulated and electric field, potential line, current, rate of impact ionization are given at different times along ion tracks. It is very important for heavy microbeam test physics models which have been set up.
出处
《计算物理》
CSCD
北大核心
2003年第5期434-438,共5页
Chinese Journal of Computational Physics