摘要
运用包装动力学中的位移损坏边界新理论 ,选择简化自典型缓冲系统的双线性动力学模型 ,用解析方法首次获得了半正弦脉冲激励下的位移损坏边界。论文的分析思路与方法 。
The displacement damage boundary (DDB)of the package system used bilinear material as cushion and driven by half sine wave impulse was introduced.At the same time,the course of solution was given.The result and basic process can give a helpful reference to research and application.
出处
《包装工程》
CAS
CSCD
北大核心
2003年第3期19-21,29,共4页
Packaging Engineering
