摘要
本文将电子散斑干涉与有限元数值计算相结合,对金属基板结构的热失效行为进行了研究.获得了低维氧化物绝缘薄膜的热失效温度,以及失效过程中基板表面的变形分布;测定了25μm厚度绝缘氧化薄膜的热膨胀系数、室温下弹性模量和失效应力等三个重要的材料常数;结合实验所测定的材料常数和研究的基板结构及性能,用有限元数值方法,模拟计算了绝缘氧化薄膜在不同缺陷形状时的失效过程,并给出了不同温度下绝缘氧化薄膜的最大应力集中值.
Electronic speckle pattern interferometry (ESPI) and finite element method (FEM) calculation have been used to investigate the thermal failure behaviors of the metal substrate in electronic packaging. The failure temperature and thermal deformation of the substrate were obtained. Material constants, thermal coefficient of expansion, elasticity modulus and failure stress of the insulating film in the room temperature were realtime measured by using ESPI. Moreover, based on the measured film constants and substrate properties, FEM has been employed to simulate the failure evolution process. The diagram of stress concentrate values vs. temperature have also been conducted in this paper.
出处
《实验力学》
CSCD
北大核心
2003年第1期17-22,共6页
Journal of Experimental Mechanics
基金
国家自然科学基金资助项目10072031的资助
