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铜磷钨玻璃的热、电特性和铜离子的迁移研究

Thermal and Electric Characteristics of Ionic Migration in Copper-Phosphorus-Tungsten Glass
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摘要 确定了30CuI-70(Cu_2O-P_2O_5-WO_3)系统的玻璃形成区,测量了玻璃转变湿度T_(?)、红外和电导率随温度和成份的变化.电导率随CuI和WO_3含量的增加而增加,在室温下对于30CuI-30Cu_2O-20P_2O_5-20WO_3样品的最高电导率值是2.1×10^(-3)Scm^(-1).在此四元系中,电导率的增大用IR、T_(?)和玻璃结构等方面进行了讨论.本文也对玻璃的交流电导率分析和介电响应等进行了描述,用AES方法观察了铜离子的迁移现象.俄歇峰的相对强度给出了铜离子的沉积量. Glass forming region in 30Cul-70(Cu_2O-P_2O_5-WO_3) system has becn established. T_(?), IR and conductivity dependance on temperature and composition have been measured. The conductivity increased with the increase of CuI and WO_3 contents. A. high ionic conductivity value 2.1×10^(-3) Scm^(-1) at room temperature has been found for the composition 30 CuI-30Cu_2O-20P_2P_-20WO_3. Conductivity eshancement observed in this quatemary system is discussed with reference to IR ,T_(?) and structural aspects. A C. conductivity analysis and dielectric response of these glasses are described. AES was used te investigate the Cu^+ion migration. Auger peak intensity gives out the amount of Cu^+ion accumulation.
出处 《硅酸盐通报》 CAS CSCD 北大核心 1992年第5期31-36,共6页 Bulletin of the Chinese Ceramic Society
关键词 玻璃 性能 离子 glass forming region Cu^+ion conducting glasses tungstate glass AES A.C. conductivity dielectric response
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