摘要
分别对可靠性强化试验中的温度循环、随机振动以及温度振动综合试验剖面中的应力类型的选择、各种应力量级的确定、施加的先后顺序等进行了研究。并阐述了温度振动综合试验应力剖面的合成及优化原则。
In this paper, the stress profiles in thermal - cycle, random - vibration and thermal & vibration composition test are illustrated, which includes the selecting of different stresses, the defining of the stress magnitude and applying order of various stresses. At the end, the composition and optimization of thermal & vibration stress profile is addressed.
出处
《电子产品可靠性与环境试验》
2003年第1期46-50,共5页
Electronic Product Reliability and Environmental Testing
