摘要
研究了碳氢树脂基黏结片的耐霉菌、耐湿热、耐高温及力学稳定性。结果表明:该黏结片材料耐霉菌性优异,适合霉菌环境;高温老化是材料力学性能变化的主导因素,在有铜箔保护的状态下材料性能优于无铜箔保护的状态,高温老化时间至500 h时,抗剥强度仍较为稳定,下降幅度仅为7.6%;温度–湿度耦合作用对于抗剥强度指标的影响更显著。结合扫描电镜分析结果,湿热循环过程中,材料微观界面出现微裂痕,微观缺陷出现累积效应,在200次湿热循环后,z轴热膨胀系数(CTE–z)从25.8×10–6℃^(–1)增至48.5×10–6℃^(–1),该变化情况略优于高温老化后的热膨胀性能变化水平。
The mold resistance,hygrothermal resistance,high temperature resistance and mechanical stability of the hydrocarbon resin-based bonding sheet were investigated.The results showed that the bonding sheet material exhibited excellent mold resistance,and was suitable for use in the mold environments.The high temperature aging was the dominant factor affecting the mechanical performance change of the material.Under the condition of copper foil protection,the performance of the material was superior to that of without copper foil protection.After 500 h of high temperature aging,the peeling strength remained relatively stable with a decrease of only 7.6%.The coupling action of the temperature and humidity had more significant impact on the peel strength index.Scanning electron microscope analysis revealed micro-cracks at the micro-interface of the material,and the microscopic defects exhibited the cumulative effect during the hygrothermal cycling.After 200 times of the hygrothermal cycling,the thermal expansion coefficient of z axis(CTE-z)increased from 25.8×10–6℃^(–1) to 48.5×10–6℃^(–1),which was slightly superior to the change level of the thermal expansion performance after high temperature aging.
作者
张殿朝
冯贝贝
金霞
Zhang Dianchao;Feng Beibei;Jin Xia(The 46th Research Institute of China Electronics Technology Group Corporation,Tianjin 300220,China)
出处
《化学推进剂与高分子材料》
2026年第2期38-44,共7页
Chemical Propellants & Polymeric Materials
关键词
碳氢树脂
黏结片
力学性能
热膨胀性能
吸水性能
hydrocarbon resin
bonding sheet
mechanical performance
thermal expansion performance
water absorption
