摘要
采用爆炸复合、轧制复合、热压扩散的方法制备层状金属复合材料,具有性能协同性、定制化、轻量化的特性。围绕电子封装外壳的引线、壳体等核心构件,详细探讨了层状金属复合材料在电子封装外壳领域的需求匹配性,系统分析了典型层状复合材料的设计与结构特征,并采取层状金属复合材料进行某型电子封装外壳的研制。通过对层状复合材料进行评价,并对外壳产品开展热冲击、温度循环、机械冲击等可靠性验证,结果表明层状复合材料外壳能够满足其高可靠电子元器件的封装技术要求,在系统整机装备和功能部件组件中具有广阔的应用前景。
Layered metal composites are prepared by methods such as explosion bonding,roll bonding,and hot-press diffusion,featuring performance synergy,customization and lightweight.Focusing on core components such as leads and shells of electronic packaging,the suitability of layered metal composites in the fi eld of electronic packaging shells is discussed in detail,and the design and structural characteristics of typical layered composites are systematically analyzed.The development of a certain type of electronic packaging shell is carried out by using layered metal composite materials.By evaluating the layered composite materials and conducting reliability verifications such as thermal shock,temperature cycling,and mechanical shock on the shell products,the results show that the layered composite material shell can meet the packaging technical requirements of its highly reliable electronic components,presenting broad application prospects in system-level equipment and functional component assemblies.
作者
钟永辉
张志成
袁小意
方军
杨磊
ZHONG Yonghui;ZHANG Zhicheng;YUAN Xiaoyi;FANG Jun;YANG Lei(The 43rd Research Institute of CETC,Hefei 230088,China;Hefei Shengda Electronics Technology Industry Co.,Ltd.,Hefei 230088,China)
出处
《电子工艺技术》
2026年第2期42-45,62,共5页
Electronics Process Technology
关键词
电子封装
层状复合
材料设计
electronic packaging
layered composite
material design
