摘要
在高密度互连板中,若盲孔填充存在空洞、凹陷或漏填等问题,将直接影响信号传输完整性、封装结构机械强度及长期工作可靠性。实际生产中,填孔凹陷主要受前处理方式、电镀设备参数(电镀电流、搅拌喷压、温度等)、电镀液成分和来料孔径大小等因素的影响。为此,针对填孔凹陷问题,通过实验研究了阶梯电流、喷压及孔径对凹陷度的影响。结果表明:阶梯电流(爆发期130%电流)可降低凹陷度30%以上;喷压由30 Hz增至40 Hz时可导致凹陷度上升20%;65μm孔径较60μm凹陷风险更高。研究结果可为高密度互连工艺优化提供技术支持。
In the high-density interconnect PCB,if blind hole filling has issues such as voids,dimples,or underfilling,it directly affects the integrity of signal transmission,the mechanical strength of the packaging structure,and long-term reliability.In actual production processes,dimple formation is primarily influenced by pretreatment methods,electroplating parameters(current,nozzle pressure,temperature),plating solution composition,and incoming via diameter.This study focuses on the dimple issue in via filling,experimentally investigating the effects of step current,nozzle pressure,and via diameter on dimple formation.The results demonstrate that step current(130%current during the burst phase)can reduce dimple depth by over 30%;increasing nozzle pressure from 30 Hz to 40 Hz leads to a 20%increase in dimple depth;and 65μm vias exhibit higher dimple risks compared to 60μm vias.This research provides a theoretical foundation for optimizing high-density interconnect processes.
作者
甘新明
黄炜彦
赵毅
GAN Xinming;HUANG Weiyan;ZHAO Yi(Greatech Substrates Co.,Ltd.,Guangzhou 510700,Guangdong,China)
出处
《印制电路信息》
2026年第3期22-28,共7页
Printed Circuit Information
关键词
高密度互连板
图形电镀填孔
填孔凹陷度
电镀电流
喷压
孔径大小
high-density interconnect PCB
graphic electroplating hole filling
fill in dimple
electroplating current
spray pressure
aperture size
