摘要
功率密度的不断提升使热问题成为高可靠电机驱动模块设计的核心难题,在设计过程中必须有效解决电控模块热的产生、传递和耗散问题。针对FR-4环氧树脂覆铜板散热能力有限而金属基板加工难度大、成本高的问题,提出一种FR-4环氧树脂覆铜板结合金属散热过渡板的导热散热方案,选用顶部散热的MOSFET,将主要发热器件(如MOSFET、采样电阻等)布置在PCB背面,并借助高导热硅胶垫片实现与金属散热过渡板的绝缘热连接,构建元件至外部散热器的高效纵向热传导路径。利用ANSYS Icepak软件建立三维热模型,施加实际工况下的功率与边界条件,仿真结果显示在满载运行时最高结温低于95℃,相较于传统驱动电路板设计降温达30℃,可满足应用要求。该方案摒弃使用昂贵的金属基板,兼顾高效散热与高可靠性,适用于中小功率电源、LED驱动及电机控制等领域,为高性价比电路板热设计提供参考。
To address the increasing thermal challenges in high-reliability motor drive modules caused by rising power density,effective management of heat generation,transfer,and dissipation must be ensured during the design process.A hybrid thermal conduction and dissipation solution was proposed,combining an FR-4 epoxy-glass laminate with a metallic heat-spreading transition section,to overcome the limitations of poor thermal conductivity in conventional FR-4 substrates and the high cost and fabrication difficulty of all-metal substrates.Top-side heat-dissipating MOSFETs were selected,and major heat-generating components(such as MOSFETs and current-sensing resistors)were mounted on the bottom side of the PCB.These components were thermally connected to the metallic transition section via high-thermal-conductivity silicone pads,establishing an efficient vertical thermal path from the components to an external heatsink while maintaining electrical insulation.A thermal model was developed using ANSYS Icepak,and simulations were conducted under realistic operating power and boundary conditions.The simulation results show that the maximum junction temperature remains below 95℃ under full load,representing a temperature reduction of 30℃ compared to conventional circuit board designs.This approach eliminates the need for expensive metal-core PCBs,achieving both high thermal performance and high reliability.The proposed solution is suitable for medium-and low-power applications such as power supplies,LED drivers,and motor control applications,and provides a cost-effective reference for thermal design of printed circuit boards.
作者
李磊
黄向华
张天宏
LI Lei;HUANG Xianghua;ZHANG Tianhong(College of Energy and Power Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China)
出处
《电子元件与材料》
北大核心
2026年第2期201-207,共7页
Electronic Components And Materials
