摘要
提出了一种基于系统级封装(SiP)技术的高集成、小型化的多核异构通用控制计算机模块设计思路和实现方法。该模块集成多核DSP、FPGA、SDRAM、Flash等9颗大规模集成电路,采用高温共烧陶瓷管壳(HTTC),通过双面双腔布局封装设计技术,实现了复杂系统电路的小型化、通用化高密度集成。此外,针对模块中高速SerDes电路信号完整性、大功率有源器件散热困难、大规模电路电源完整性等问题,通过综合机、电、力、热等仿真及优化方法,实现了模块高密度集成过程中电路的高可靠设计,并完成了样品小批量试制和功能性能测试。经测试,产品尺寸为39 mm×39 mm×6.49 mm,重量为29 g,相比于分立器件组合的系统,体积重量可降低80%以上。常温25℃及高温105℃下,微系统模块内部DSP和FPGA功能运行稳定、存储器读写正常、高速通信速率可达5 Gb/s,各项功能和性能指标均满足设计预期。本研究为系统级封装产品的小型化、高集成、高可靠设计提供思路和方法。
This paper demonstrates a design of high integrated and miniaturized multi-core general-purpose control computer module,which can be implemented through the system-in-packaging(SiP)technology.This module integrates nine large-scale integrated circuits,including multi-core DSP,FPGA,SDRAM,and Flash.It employs a high-temperature co-fired ceramic(HTCC)tube shell and utilizes a double-sided dual-cavity layout packaging design technology to achieve miniaturization,generalization,and high-density integration of complex system circuits.Additionally,to address issues such as the integrity of high-speed SerDes circuit signals,the difficulty of heat dissipation from high-power active devices,and the integrity of large-scale circuit power supplies within the module,a high-reliability design was achieved through comprehensive simulation and optimization methods covering mechanical,electrical,and thermal aspects.Small-scale trial production and functional performance testing have also been completed.The product measures 39 mm×39 mm×6.49 mm and weighs 29 g.Compared to a system composed of discrete components,the volume and weight are reduced by over 80%.At ambient temperature(25°C)and high temperature(105°C),the DSP and FPGA functions within the microsystem module operate stably,memory read/write operations function normally,and the high-speed communication rate can reach 5 Gb/s.All functions and performance indicators meet the design expectations.The work presented in this manuscript can provide ideas and methods for the miniaturization,high integration,and high-reliability design of similar system-level packaging products.
作者
李超
李宾
王艳
Li Chao;Li Bin;Wang Yan(Beijing Sunwise Space Technology Ltd.,Beijing 100190,China)
出处
《电子技术应用》
2026年第2期28-34,共7页
Application of Electronic Technique
关键词
微系统
系统级封装
高温共烧陶瓷
多核异构
计算机模块
micro-system
system-in-packaging
high-temperature co-fired ceramic
multi-core heterogeneous
computer module
