摘要
目的比较半导体激光牙龈切除术与手工刀牙龈切除术配合纳米树脂充填治疗龈下楔状缺损患者的效果。方法选取2023年1月至2024年1月于医院就诊的96例龈下楔状缺损患者(124颗患牙)作为研究对象,采用随机数字表法分为对照组(48例,60颗患牙)和试验组(48例,64颗患牙)。对照组采用手工刀牙龈切除术,试验组采用半导体激光牙龈切除术,两组切除术后7 d均采用纳米树脂充填楔状缺损,充填后随访6个月。比较两组切除术前和充填后24、48、72、96 h的疼痛程度[采用视觉模拟评分法(VAS)评估],以及充填后6个月的修复合格率(包括边缘适应性、继发龋、颜色匹配、牙龈健康、外形)和随访期间的并发症发生率。结果充填后24、48、72 h,试验组VAS评分均低于对照组,差异有统计学意义(P<0.05);充填后6个月,试验组牙龈健康修复合格率高于对照组,差异有统计学意义(P<0.05);随访期间,试验组并发症发生率低于对照组,差异有统计学意义(P<0.05)。结论与手工刀牙龈切除术相比,半导体激光牙龈切除术配合纳米树脂充填治疗龈下楔状缺损,可降低患者的疼痛程度,提高牙龈健康修复效果,降低并发症发生风险,为纳米树脂充填提供更优的条件。
Objective To compare the efficacy of semiconductor laser gingivectomy and manual blade gingivectomy combined with nano-resin restoration in the treatment of patients with subgingival wedge-shaped defects.Methods A total of 96 patients with subgingival wedge-shaped defects(124 affected teeth)who visited the hospital from January 2023 to January 2024 were selected as the research subjects and divided into the control group(48 cases,60 affected teeth)and the experimental group(48 cases,64affected teeth)by the random number table method.The control group was treated with manual blade gingivectomy,while the experimental group was treated with semiconductor laser gingivectomy.Both groups were treated with nano-resin restoration of wedge-shaped defects on the seventh day after resection,and followed up for 6 months after restoration.The degree of pain before resection and 24,48,72,and 96 hours after restoration[evaluated by visual analogue scale(VAs)]in the two groups,as well as the qualified rate of repair(including marginal adaptability,secondary caries,color matching,gum health,and appearance)at 6 months after restoration and the incidence of complications during the follow-up period were compared.Results At 24,48,and 72 hours after restoration,the VAS scores of the experimental group were lower than those of the control group,and the differences were statistically significant(P<0.05).At 6 months after restoration,the qualified rate of gingival health restoration in the experimental group was higher than that in the control group,and the difference was statistically significant(P<0.05).During the follow—up period,the incidence of complications in the experimental group was lower than that in the control group,and the difference was statistically significant(P<0.05).Conclusion Compared with manual blade gingivectomy,semiconductor laser gingivectomy combined with nano-resin restoration can reduce the pain level of patients,improve gum health restoration effect,reduce the risk of complications,and provide better conditions for nano-resin restoration in the treatment of subgingival wedge-shaped defects.
作者
陈泽兴
Chen Zexing(The First Affiliated Hospital of Xiamen University,Xiamen Fujian 361001,China)
出处
《医疗装备》
2025年第24期30-33,37,共5页
Medical Equipment
关键词
半导体激光牙龈切除术
手工刀牙龈切除术
龈下楔状缺损
纳米树脂充填
疼痛程度
修复效果
Semiconductor laser gingivectomy
Manual blade gingivectomy
Subgingival wedge-shaped defects
Nano-resin restoration
Pain level
Restoration effect
