摘要
为解决航天高密度PCBA(Printed Circuit Board Assembly)组件SMT(Surface Mounted Technology)回流焊温度场仿真中传热考虑欠缺、精度不足的问题,开展了有限元仿真技术研究。考虑PCBA组件的覆铜走线对传热影响和回流炉不同温区间温度串联变化,提出了一种温度场的串温补偿机制,设计动态温度加载算法模拟其温度边界条件,在流体仿真软件FloEFD中构建了覆盖回流炉与PCBA三维热传递的综合仿真模型;进一步开发集成工艺建模与仿真结果可视化的智能仿真软件平台。以某典型PCBA组件为例,结果显示:针对6个典型监控点,仿真模型输出温度曲线关键指标的相对误差均低于行业允许阈值(峰值温度±5℃、升温斜率±0.5℃/s、冷却斜率±1℃/s、熔锡时间±10%)。结论表明,该仿真方法能显著提升密集布线区域温度预测准确性,体现传热分配不均匀特性,所开发智能平台实现了从工艺参数输入到关键指标输出的全流程智能化,为航天电子组件回流焊工艺优化提供高效工具。
To address the insufficient consideration of heat transfer and low accuracy in temperature field simulations for Surface Mounted Technology(SMT)reflow soldering of high-density Printed Circuit Board Assembly(PCBA)components in aerospace applications,a finite element simulation technology study was conducted.The influence of copper-clad traces on heat transfer within PCBA components and the sequential temperature changes across different temperature zones of the reflow oven were incorporated.A sequential temperature compensation mechanism for the temperature field was proposed,and a dynamic temperature loading algorithm was designed to simulate temperature boundary conditions.A comprehensive simulation model encompassing 3D heat transfer between the reflow oven and PCBA was established using the fluid simulation software FloEFD.Additionally,an intelligent simulation software platform integrating process modeling and simulation result visualization was developed.Taking a typical PCBA component as an example,the results show that for six typical monitoring points,the relative errors of key temperature curve indicators output by the simulation model all fall below industry-allowed thresholds(peak temperature±5℃,heating slope±0.5℃/s,cooling slope±1℃/s,solder melting time±10%).It is concluded that this simulation method significantly improves the temperature prediction accuracy in dense wiring areas and effectively reflects the uneven distribution of heat transfer.The developed intelligent platform achieves full-process intelligence from process parameter input to key indicator output,providing an efficient tool for optimizing reflow soldering processes of aerospace electronic components.
作者
王博宇
黄少华
郭宇
王燕清
侯霄宇
孙浩
WANG Boyu;HUANG Shaohua;GUO Yu;WANG Yanqing;HOU Xiaoyu;SUN Hao(College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;The 14th Research Institute of China Electronics Technology Group Corporation,Nanjing 210039,China)
出处
《电子元件与材料》
北大核心
2025年第12期1464-1473,共10页
Electronic Components And Materials
关键词
回流焊
有限元仿真
覆铜保留
串温补偿
仿真平台
reflow soldering
finite element simulation
copper-clad retention
series temperature compensation
simulation platform
