摘要
基于基板折叠的多面立体封装由互不平行的基板构成,是一种特殊的3D立体封装,具有较高的功能密度和散热能力,在传感器、医疗设备等多种应用场景下有重要的研究价值。介绍了基于基板折叠的多面立体封装的概念与国内外研究现状,系统总结了该类封装的典型结构、基板材料、组装工艺、散热及代表性应用。重点分析了基于基板折叠的多面立体封装与其他类型3D封装之间的差异,探讨了该封装技术的独特优势与亮点。最后,对该技术在有源相控阵T/R组件和光电共封领域的发展前景进行了展望。
Polyhedral 3D packaging based on substrate folding consists of non-parallel substrates,representing a specialized form of 3D packaging.It offers high functional density and thermal dissipation capabilities,making it a subject of significant research value across diverse applications such as sensors and medical devices.The concept of polyhedral 3D packaging based on substrate folding is introduced and the current states of research both domestically and internationally are reviewed.The typical structures,substrate materials,assembly processes,thermal management,and representative applications of this type of packaging are systematically summarized.The distinctions between substrate folding-based polyhedral packaging technology and other 3D packaging types are analyzed,highlighting its unique advantages and salient features.Finally,development prospects in the fields of active phased array T/R modules and co-packaged optics are outlined.
作者
毕博
潘碑
张晋
成海峰
葛振霆
刘子玉
BI Bo;PAN Bei;ZHANG Jin;CHENG Haifeng;GE Zhenting;LIU Ziyu(School of Microelectronics,Fudan University,Shanghai 200433,China;Nanjing Electronic Devices Institute,Nanjing 210016,China;School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China)
出处
《电子与封装》
2025年第12期47-58,共12页
Electronics & Packaging
基金
中国电子科技集团公司第五十五研究所基础性研究项目(2308N151)。
