摘要
针对传统方法难以全面覆盖导线压接部位、缺陷检测精度不足的问题,文章提出一种基于红外成像技术的导线压接缺陷检测方法。通过构建压接区域温度场控制方程,分析接触电阻增大、氧化腐蚀、压接松动等缺陷的传热特性;以压接区域表面温度与环境参照体温度差为判据,结合红外成像温度分布实现缺陷识别。实验结果表明,该方法将#1导线、#2导线、#3导线的检测温度误差控制在1℃以内,识别出的缺陷类型与实验结果一致,具有较高的准确性和有效性。
To address the issues that traditional methods struggle to comprehensively cover wire crimping areas and lack sufficient defect detection accuracy,this article proposes a defect detection method for wire crimping based on infrared imaging technology.By establishing the control equation for the temperature field in the crimping region,the heat transfer characteristics of defects such as increased contact resistance,oxidation corrosion,and crimping loosening are analyzed.Using the temperature difference between the surface temperature of the crimping region and the environmental reference body as the criterion,combined with the temperature distribution from infrared imaging,defect identification is achieved.Experimental results show that this method controls the detection temperature errors of#1,#2,and#3 wires within 1℃,and the identified defect types are consistent with experimental results,demonstrating high accuracy and effectiveness.
作者
王玉壮
WANG Yuzhuang(Shandong Liancheng Power Engineering Co.,Ltd.,Jinan 250031,China)
关键词
温度场控制
红外成像技术
导线压接
缺陷检测
temperature field control
infrared imaging technology
wire crimping
defect detection
