摘要
The rapid advancement of high-speed electronic devices has driven the need for new materials that can meet the demands for higher performance,miniaturization,and energy efficiency.Among these materials,graphene has garnered significant attention due to its exceptional electrical,thermal,and mechanical properties.This paper reviews the research progress on graphene-based composites and their application in high-speed electronics,focusing on the material's unique characteristics and its potential to enhance the performance of electronic devices.The paper examines various graphene-based composite materials,including graphene/polymer,graphene/metal,and graphene/ceramic composites,highlighting their fabrication methods,functionalization strategies,and integration with other materials.Moreover,the paper explores the critical challenges related to scalability,interface compatibility,and integration with existing semiconductor processes.In addition,performance evaluation methodologies and reliability assessments are discussed in the context of electrical,thermal,and mechanical properties.Despite the promising potential of graphene-based composites,challenges such as cost-effective large-scale production,material dispersion,and interface engineering remain.The review concludes by offering insights into future directions for graphene-based materials in high-speed electronic devices,emphasizing the need for further research into scalable manufacturing techniques and functionalization strategies to overcome these challenges.
