摘要
研究了无机填料添加对木质素基酚醛树脂胶黏剂(LPF)中甲醛释放量的影响,并进一步优化了LPF制备的工艺参数。结果表明,在合成中添加无机填料可降低胶合板甲醛释放量,其中在第一批加料时添加总量1%的蒙脱土,在最适压板工艺参数:热压温度160℃、热压压力1.2 MPa和热压时间6 min条件下,胶合强度为1.54 MPa,满足Ⅰ类胶合板要求,甲醛释放量为0.089 mg/L(E0级)。FTIR和TG表征表明其具有更好的胶黏特性和热稳定性。
The impact of adding inorganic fillers on the formaldehyde emission of preparing lignin-based phenol formaldehyde(LPF)are studied,and the process parameters of LPF are further optimized.Results indicate that adding inorganic fillers can reduce the emission of formaldehyde and phenol in the process of LPF synthesis.The results showed that adding clay mineral filler in the process of synthesis of LPF can effectively decrease the emission of formaldehyde when the montmorillonite with 1%of the total adhesive content is added in the first batch.The optimized process parameters of plywood:the pressing plate temperature is 160℃,the pressing plate pressure is 1.2 MPa and the pressing plate time is 6 min.The bonding strength is 1.54 MPa,which meets the requirements of ClassⅠplywood.The formaldehyde emission is 0.089 mg/L(E0 grade)and showed adhesive properties and thermal stability characterized by FTIR and TG.
作者
庄军平
刘宇旗
ZHUANG Junping;LIU Yuqi(State Key Laboratory of Pulp and Paper Engineering,South China University of Technology,Guangzhou 510641,China)
出处
《应用化工》
北大核心
2025年第11期2777-2780,共4页
Applied Chemical Industry
基金
国家重点研发计划(2022YFC2805104)。
关键词
木质素
酚醛树脂
矿物填料
甲醛释放量
胶合强度
lignin
phenolic resin
mineral filler
formaldehyde emission
bond strength
