摘要
电子通信技术的不断迭代对基材电性能和可靠性要求持续提高。本文探讨以改性聚苯醚树脂、交联剂、低介电常数功能填料、阻燃剂为主要原料开发的一种高性能无卤覆铜板。该覆铜板可实现低介电损耗、高玻璃化转变温度(T_(g))、低X/Y-热膨胀系数(CTE)、低涨缩翘曲,且具备优异的印制电路板(PCB)加工性能,并在PCB测试板上验证了高多层(32层/4.5mm)属性。研究证明:上述基材在高速、多阶高密度互连板(HDI)甚至部分封装类产品制造中具有相当广阔的应用前景。
The continuous iteration of electronic communication technologies imposes increasingly stringent demands on the electrical performance and reliability of substrate materials.This paper presents a novel halogen-free copper clad laminate(CCL)developed using modified polyphenylene ether(PPO)resin,a crosslinking agent,functional fillers.This CCL exhibits exceptional performance characteristics:Low dielectric loss(Df),High glass transition temperature(Tg),low coefficient of thermal expansion(CTE)and minimal dimensional change and warpage.And it has excellent PCB processability,validated on a high-layer count(32 layers/4.5 mm thickness)test board for PCB,Demonstrates promising application potential in high-speed circuits,multi-stage HDI PCBs,and even certain packaging substrates.This CCL offers a solution for advanced electronic applications.
作者
张秋
曾宪平
ZHANG qiu;ZENG Xianping(National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd.,Dongguan 523808,Guangdong,China)
出处
《印制电路信息》
2025年第12期12-16,共5页
Printed Circuit Information
关键词
无卤覆铜板
复合材料
低热膨胀系数
高耐热性
halogen⁃free copper clad laminate
composite material
low coefficient of thermal expansion(CTE)
high thermal reliability
