摘要
为实现覆铜板和印制电路板的设计与制造绿色化,亟需覆铜板树脂基体环保替代材料。本研究通过构建酯交换树脂体系,开发可在常压下实现树脂基体降解的覆铜板,并分析催化剂对覆铜板性能及可降解性的影响。结果表明,采用酸性酯化催化剂和碱性酯化催化剂的板材其可降解性较好,但其玻璃化转变温度(T_(g))和模量一定程度上有所下降;2E4MZ催化剂虽有较高的T_(g)和模量,但不可降解;为兼顾使用性及可降解性,可选择酸性酯化催化剂作为催化剂。本研究开发的可降解覆铜板各项性能均与普通FR-4接近,有望用于绿色可降解覆铜板制造领域。
To achieve the greening of copper-clad laminates and printed circuit boards,making environmentally friendly alternative materials urgently needed.In this paper,a transesterification resin system was constructed to develop a copper-clad laminate whose resin matrix can be degraded under normal pressure.The research shows that catalysts affect the glass transition temperature(Tg),modulus,and degradability of the copper-clad laminates.Among them,the laminates with acidic esterification catalyst and alkaline esterification catalyst exhibit better degradability,but their Tg and modulus decrease to a certain extent.Although the 2E4MZ catalyst provides higher Tg and modulus,the laminate cannot be degraded.To balance service performance and degradability,acidic esterification catalyst was selected as the catalyst.The developed degradable copper-clad laminate has properties close to those of ordinary FR-4,showing great potential for application in the manufacturing field of green degradable copper-clad laminates.
作者
陈林锴
王岳群
王东林
CHEN Linkai;WANG Yuequn;WANG Donglin(Shantou Goworld Lamination Co.,Ltd.,Shantou 515071,Guangdong,China)
出处
《印制电路信息》
2025年第12期6-11,共6页
Printed Circuit Information
关键词
覆铜板
可降解性
动态共价热固性树脂
催化剂
copper⁃clad laminate
degradable
dynamic covalent thermosetting resin
catalyst
