摘要
PCB阻抗测试是一种有效的评估电源质量的测试方法,然而PCB上电源轨的阻抗往往是mΩ级别的,稍有不慎就容易造成测试误差。本文结合实际测试数据,对影响测试结果的关键因素进行分析,包括测试点选取、功率的设置、焊接等。并在PCB板上实测两组电源轨,通过开环和闭环阻抗分析、伯德图分析、纹波时域测量等方式间接证明测试结果的合理性。
PCB impedance is an effective method for evaluating power quality.However,the impedance of powers on PCB is often in the mΩrange,and even slight carelessness can lead to test errors.This article combines test data to analyze the key factors that affect test results,including test point selection,power setting,and soldering.Two sets of powers on the PCB are measured,and the test results are analyzed through open-loop and closed-loop impedance,bode plot,time-domain ripple test.
作者
刘清
刘尧禹
陈松涛
LIU Qing;LIU Yao-yu;CHEN Song-tao(Shanghai Enflame Technology Co.,Ltd)
出处
《中国集成电路》
2025年第11期77-81,共5页
China lntegrated Circuit