摘要
氧化铈(CeO_(2))磨料广泛应用于光学玻璃的表面平坦化加工,其粒径尺寸对玻璃去除速率和表面质量有着至关重要的影响。现针对K9玻璃的高去除速率和高表面质量要求,研究五种不同粒径CeO_(2)磨料在单一及混合使用条件下对K9玻璃化学机械抛光(CMP)性能的影响。采用H_(2)O_(2)处理CeO_(2)抛光液来对材料的总去除速率进行量化分解,并结合XPS表征分析,揭示不同粒径CeO_(2)磨料的去除机制。结果表明,随着单一CeO_(2)磨料粒径的增大,K9玻璃的去除速率经历了先增大后减小的变化,抛光后的表面粗糙度经历了先减小后增大的变化,并在粒径50 nm和300 nm时分别获得较高的材料去除速率(99.53 nm/min)和较低的表面粗糙度(1.27 nm)。同时,粒径50 nm与300 nm的混合CeO_(2)磨料显著提高K9玻璃的去除速率,当二者的质量比为1∶2时,K9玻璃获得了良好的去除速率(121.72 nm/min)和良好的表面粗糙度(1.24 nm)。CeO_(2)磨料的机械磨削作用与其粒径呈正相关,而化学活性则与粒径呈负相关。CeO_(2)磨料化学机械协同作用是材料去除的主要方式,混合磨料体系结合了小粒径磨料化学作用强和大粒径磨料磨削作用强的优势,提升了K9玻璃的抛光性能,其研究结果将为K9玻璃等光学材料光整加工的抛光液研发提供较好的参考。
K9 glass is widely used in aerospace,military,and optoelectronic applications owing to its high mechanical strength,exceptional wear resistance,superior optical transparency,and excellent thermal stability.However,as a typical hard-brittle material characterized by low fracture toughness,K9 glass is more prone to subsurface damage and crack formation during machining processes.Chemical mechanical polishing(CMP),which is recognized for its high processing efficiency,simplified equipment configuration,and cost-effectiveness,has been extensively adopted for the surface finishing of optical glasses and other hard-brttle materials.Cerium oxide(CeO_(2))abrasives are widely used in the surface planarization of optical glasses owing to their unique chemical reactivity with silica.Moreover,their particle size distributions play critical roles in determining both the material removal rate and surface quality.To meet the stringent requirements for a high material removal rate and superior surface quality in K9 glass polishing,this study systematically investigated the effects of five distinct particle sizes of CeO_(2) abrasives on the CMP performance of K9 glass,both individually and in hybrid configurations.To isolate and quantify the contributions of the chemical and mechanical actions of the abrasives,the chemical effects of the CeO_(2) abrasives were suppressed via the hydrogen peroxide(H_(2)O_(2))treatment of the polishing slurry.This approach enables the decomposition of the total removed material into three fundamental components:mechanical action,chemical action,and synergistic interactions.In conjunction with an surface analysis using X-ray photoelectron spectroscopy(XPS),the surface chemical properties of CeO_(2) abrasives with varying particle sizes were systematically characterized to elucidate the material removal mechanisms of different CeO_(2) abrasives during a polishing process.The results showed that the material removal rate of K9 glass initially increased and then decreased as the particle size of the single CeO_(2) abrasive increased.In contrast,the surface roughness exhibited the opposite trend.A high material removal rate(99.53 nm/min)and low surface roughness(1.27 nm)were achieved at particle sizes of 50 and 300 nm,respectively.Moreover,the combination of Ce02 abrasives with particle sizes of 50 and 300 nm significantly improved the removal rate of K9 glass.When the mass ratio of the combination was 1:2,the K9 glass exhibited an excellent removal rate(121.72 nm/min)and surface roughness(1.24 nm).When H_(2)O_(2)-treated CeO_(2) slurries were employed to suppress chemical interactions,neither mechanical abrasion from the polishing pad nor pure chemical action by abrasives contributes measurably to material removal.The pure mechanical action of abrasives achieved a relatively low material removal rate.Moreover,the ratio(K)of the pure mechanical removal rate to the total removal rate exhibited an increasing trend with an increase in abrasive particle size.Specifically,the values of the parameter K for abrasives with particle sizes of 20 nm and 1μm were 3.32%and 18.9%,respectively.The results of a surface analysis via XPS revealed that the surface Ce^(3+)concentration decreased as the particle size of the CeO_(2) abrasives increased.Specifically,the Ce^(3+)concentrations for abrasives with particle sizes of 20 nm and 1μm were measured at 29.5%and 25.33%,respectively.In the chemical-mechanical polishing of K9 glass,the synergistic interaction between the chemical and mechanical actions of the CeO_(2) abrasives served as the dominant material removal mechanism.Smaller CeO_(2) abrasive particles exhibited stronger chemical activity,and the surface Ce3 concentration significantly influenced the material removal rate.Mechanical action was an indispensable component of this process.In contrast,larger abrasive particles demonstrated weaker chemical effects but exhibited enhanced mechanical grinding capabilities.The hybrid abrasive system,which effectively combined the enhanced chemical reactivity of small particles with the superior mechanical grinding capability of large particles,significantly improved the polishing performance of K9 glass.These results provide valuable theoretical and practical insights for the development of advanced polishing slurries for the precision machining of K9 glass and other optical materials.
作者
姜峰
钱善华
屈克松
卞达
倪自丰
JIANG Feng;QIAN Shanhua;QU Kesong;BIAN Da;NI Zifeng(College of Mechanical Engineering,Jiangnan University,Wuxi 214122,China;Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology,Wuxi 214122,China)
出处
《中国表面工程》
北大核心
2025年第5期107-118,共12页
China Surface Engineering
基金
国家自然科学基金(52375184)
江苏省食品先进制造装备技术重点实验室自主研究课题(FMZ202204)
江苏高校“青蓝工程”项目。
关键词
K9玻璃
氧化铈
粒径
去除速率
表面粗糙度
K9 glass
cerium dioxide
particle size
removal rate
surface roughness
