摘要
为了降低金刚石线锯切割过程中硅片的温度和热应力,将静电喷雾冷却方式应用于线锯切割。建立硅片温度场数学模型,模拟线锯切割过程中硅片的温度场分布,并通过线锯切割实验验证仿真结果,在此基础上将温度场结果作为边界条件进行热应力分析。仿真和实验结果表明,与浇注冷却和喷雾冷却方式相比,静电喷雾冷却方式下硅片最高温度分别降低了15.35%和5.99%,硅片最高热应力分别降低了33.30%和45.56%,静电喷雾冷却可以有效降低硅片温度,提高线锯切割过程中硅片温度分布均匀性,降低硅片热应力;在3种冷却方式下,硅片温度场和热应力场的分布规律相似,最高值都在切割区域的中部。
To reduce the temperature and thermal stress of silicon wafers during diamond wire sawing,the electrostatic spraying cooling method is used in wire sawing.A mathematical model of heat generation during wire sawing process is established to simulate the distribution of temperature field of silicon wafers during this process.After verifying the result with sawing experiment,the temperature field is used as a boundary condition to carry out thermal stress analysis.The results show that compared with pouring and spraying,the maximum temperature of the wafer under electrostatic spraying cooling method is reduced by 15.35%and 5.99%,and the maximum thermal stress is reduced by 33.30%and 45.56%,respectively.The electrostatic spraying cooling method effectively lowers the temperature of silicon wafers,improve the uniformity of the temperature distribution in wire sawing,and reduce the thermal stress of silicon wafers.The distribution of temperature field and thermal stress field of the wafer under the three cooling methods are similar,and the maximum values are in the middle of the sawing area.
作者
姚春燕
杜宇振
王明环
YAO Chunyan;DU Yuzhen;WANG Minghuan(College of Mechanical Engineering,Zhejiang University of Technology,Hangzhou 310023;Key Laboratory of Special Purpose Equipment and Advanced Processing Technology,Ministry of Education and Zhejiang Province,Hangzhou 310023)
出处
《高技术通讯》
北大核心
2025年第10期1145-1152,共8页
Chinese High Technology Letters
基金
浙江省自然科学基金(LY21E050007)
国家自然科学基金(51975532)资助项目。
关键词
静电喷雾冷却
线锯切割
温度场
热应力场
electrostatic spraying cooling
wire sawing
temperature field
thermalstress field
