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高温薄膜热流传感器的设计及仿真

Design and Simulation of a High Temperature Thin-film Heat Flux Sensor
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摘要 针对超高温恶劣环境中难以实现准确检测大热流的技术难题,设计一种双端对称结构的高温薄膜热流传感器,基于有限元仿真方法,研究分析关键结构参数对输出电压和抗环境干扰性能的影响关系。仿真结果表明,优化后的传感器在1 MW/m^(2)的热流密度下,响应电压为51.05 mV,抗环境温度干扰系数为0.082 mV/℃,灵敏度达0.051 mV/(kW/m^(2)),具有良好的响应输出和抗环境干扰性能,可满足1 000℃高温环境下大热流的测量需求,同时该研究为研制高性能的薄膜热流传感器提供有力参考。 To address the technical challenges associated with precise detection in extreme environments characterized by ultra-high temperatures and high heat flux,a dual-end symmetrical structure high-temperature thin film thermal flux sensor is designed.Based on finite element simulation method,the study analyzes the influence relationship between key structural parameters and the output voltage as well as the resistance to environmental interference performance.The simulation results demonstrate that under a heat flux density of 1 MW/m^(2),the optimized sensor exhibits a response voltage of 51.05 mV along with an environmental temperature interference coefficient immunity value of 0.082 mV/℃ and sensitivity value of 0.051 mV/(kW/m^(2)),showcasing exceptional response output capabilities as well as resistance against environmental interference.The sensor meets the needs of large heat flux measurements in high temperature environments up to 1000℃.Moreover,this study provides valuable insights for advancing the development of high-performance thin film heat flux sensors.
作者 宫明峰 雷程 刘东 白悦杭 邵泊游 谢宇 余建刚 梁庭 GONG Mingfeng;LEI Cheng;LIU Dong;BAI Yuehang;SHAO Boyou;XIE Yu;YU Jiangang;LIANG Ting(Key Laboratory of Micro/nano Devices and Systems,Ministry of Education,North University of China,Taiyuan 030051;Huaihai Industrial Group Co.,Ltd.,Changzhi 046012)
出处 《舰船电子工程》 2025年第8期94-99,共6页 Ship Electronic Engineering
基金 国家重点研发计划(编号:2023YFB3208500) 中央引导地方科技发展资金项目(编号:YDZJSX20231B006)资助。
关键词 高温 热流密度 薄膜热流传感器 有限元仿真 high temperature heat flux thin-film heat flux sensor finite element simulation
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