摘要
聚酰亚胺(PI)具有优异的耐高温性、机械性能和化学稳定性等性能,在航空航天、微电子、新能源等高新技术领域具有广泛的应用前景。基于全球专利文献的检索与分析,系统研究了PI技术的全球专利布局态势,重点对专利申请的年趋势分布、地域分布、主要申请人、技术布局等进行深入分析,为国内PI材料的技术创新与专利布局提供建议和思路。
Polyimide(PI),characterized by exceptional high-temperature resistance,mechanical properties,and chemical stability,holds broad application prospects in high-tech fields such as aerospace,microelectronics,and new energy.Based on the retrieval and analysis of global patent literature,a systematic study is conducted on the global patent landscape of polyimide technology,with a focus on analyzing the annual trend distribution,geographical distribution,key applicants,and technology distribution of patent applications.This research provides insights and strategic recommendations for technological innovation and patent layout of polyimide materials in China.
作者
袁晓亮
余倩倩
张佳
张馨月
张天琪
李天舒
YUAN Xiao-liang;YU Qian-qian;ZHANG Jia;ZHANG Xin-yue;ZHANG Tian-qi;LI Tian-shu(PetroChina Petrochemical Research Institute,Beijing 102206,China)
出处
《现代化工》
北大核心
2025年第11期5-10,共6页
Modern Chemical Industry
