摘要
本文基于低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)三维封装技术,通过将多节四分之一波长阻抗变换线进行折叠布局和垂直堆叠设计,实现了多节宽带功分器的高度集成.本设计将7节阻抗变换线分别放置在LTCC介质的奇数层上,相邻阻抗变换线之间采用垂直过孔进行连接,偶数层用来隔离阻抗变换线之间的耦合效应.该功分器不仅实现了180%的相对带宽,而且尺寸仅为4 mm×4 mm×1.33 mm.相比同样传输节数平面型功分器,本设计的水平尺寸减小了84.6%.在2~38 GHz的频率范围内,S_(11)、S_(21)、S_(22)、S_(31)和S_(32)的实测值分别优于-15、-4.1、-16、-4.0和-17 dB.该功分器同时具有超宽带特性和小型化、高度集成的优势,可广泛应用于移动通信、雷达探测、卫星导航、工业测量等领域中.
Based on the low temperature co-fired ceramic(LTCC)three-dimensional packaging technology,this pa⁃per folds and vertically stacks multiple quarter-wavelength impedance transformation lines to achieve high integration in a multi-section broadband power divider.This design places 7 impedance transformation lines on the odd layers of the LTCC medium,and vertical vias are used to connect adjacent impedance transformation lines.Even layers are used to isolate the coupling effect between impedance transformation lines.The power divider not only achieves a relative bandwidth of 180%,but also has a size of only 4 mm×4 mm×1.33 mm.Comparing with the planar power divider with the same number of transmission sections,the horizontal size of this design is reduced by 84.6%.In the frequency range of 2~38 GHz,the measured values of S_(11),S_(21),S_(22),S_(31)and S_(32)are better than-15,-4.1,-16,-4.0 and-17 dB,respectively.Since the power di⁃vider has the advantages of ultra-wideband characteristics,miniaturization and high integration,it can be widely used in mo⁃bile communications,radar detection,satellite navigation,industrial measurement and other fields.
作者
蒋俊毅
王梓丞
施刚
胡善文
JIANG Jun-yi;WANG Zi-cheng;SHI Gang;HU Shan-wen(College of Electronic and Optical Engineering&College of Flexible Electronics(Future Technology),Nanjing University of Posts and Telecommunications,Nanjing,Jiangsu 210023,China)
出处
《电子学报》
北大核心
2025年第6期1917-1922,共6页
Acta Electronica Sinica
基金
国家自然科学基金(No.61501261)
江苏省射频集成与微组装技术国家地方联合实验室研究基金(No.KFJJ20200101)
江苏省前沿技术研发计划(No.BF2024080)。
关键词
三维集成
多节威尔金森功分器
小型化
超宽带
低温共烧陶瓷
three-dimensional integration
multi-section Wilkinson power divider
miniaturization
ultra-wideband
low temperature co-fired ceramic
