摘要
整理了半导体设备运输过程中的潜在风险及对应的预防方案,研究了运输过程中振动与冲击的具体量级,介绍了运输工装在运输过程中的减振手段与使用方法,并给出了针对半导体设备抗振能力的振动试验检验方案。根据模拟运输实例,提出了半导体设备运输需保证指标及具体监测方案,采集了运输过程的振动数据与温度数据,验证了运输包装方案的合理性。
The potential risks and prevention plans during transportation of semiconductor equipment are arranged,the specific levels of vibration and impact during transportation are studied,the vibration reduction methods are introduced,and a vibration test and inspection plan are provided for semiconductor equipment.Based on simulated transportation examples,transportation guarantee indicators and specific monitoring plans for semiconductor equipment are proposed.Vibration and temperature data during transportation are collected to verify the rationality of the transportation packaging plan.
作者
杨师
郑东豪
田世伟
王浩楠
YANG Shi;ZHENG Donghao;TIAN Shiwei;WANG Haonan(The 45^(th) Research Institute of CETC,Beijing 100176,China)
出处
《电子工业专用设备》
2025年第5期24-29,共6页
Equipment for Electronic Products Manufacturing
关键词
半导体设备
运输环境安全
振动控制
Semiconductor equipment
Transportation environment safety
Vibration Control
