摘要
微焊过程中Cu焊盘尺寸的减小,导致了微焊点的界面金属间化合物(IMC)占比则相对增大,而Cu的晶向对IMC性能的影响越来越不可忽视。以晶向分别为(111)、(110)和(100)的单晶Cu为金属基底,SAC305为无铅焊料,探究铜晶向对IMC生长行为的影响。采用扫描电子显微镜(SEM)、能量色散X射线谱仪(EDS)以及电子背散射衍射(EBSD)等表征手段,研究了在固-固等温时效下的界面变化和生长动力学以及不同单晶Cu表面所生成的IMC生长的晶向取向特征。结果表明:(110)Cu/SAC305的IMC界面扩散系数最大,其次依次是(100)Cu/SAC305、(111)Cu/SAC305,并发现扩散系数和晶面的致密度呈负相关。在与Cu6Sn5(-12-10)η晶面平行的单晶铜中,(111)Cu与(100)Cu晶面呈现竞争趋势,受基底Cu晶向影响明显,而(0001)η/(110)Cu始终保持相对的一致性,不受基底Cu晶向影响。
The size reduction of Cu pad during micro-soldering leads to an increase on the proportion of interfacial intermetallic compounds(IMC)in micro-solder joints,so the influence of Cu grain orientation on the IMC performance turns more and more unnoticeable.In order to investigate the effect of Cu grain orientation on IMC growth behavior,single-crystal Cu with grain orientations of(111),(110)and(100),respectively,was used as the metal substrate,and SAC305 solder was used as the brazing alloy.The interfacial changes and growth kinetics under solid-solid isothermal aging as well as the grain orientation features of IMC growth generated on different single-crystal Cu surfaces were investigated by scanning electron microscopy(SEM),energy dispersive X-ray spectrometry(EDS),and electron backscattering diffraction(EBSD)characterization methods.The results showed that the diffusion coefficient of(110)Cu/SAC305 was the largest,sequentially followed by(100)Cu/SAC305 and finally(111)Cu/SAC305,and a negative correlation was found between the diffusion coefficient and the densities of the crystal surfaces.In the single-crystal Cu parallel to the(-12-10)ηcrystal faces of Cu6Sn5,the(111)Cu and(100)Cu crystal faces showed a competing trend due to the influence from the crystal orientation of Cu,whereas the(0001)η/(110)Cu always remained relatively coherent with no obvious influence from the crystal orientation of Cu.
作者
杜永杰
邓晓明
陈晓丽
王跃川
曹巍
周琦
王悦聪
王军
陈苑明
Du Yongjie;Deng Xiaoming;Chen Xiaoli;Wang Yuechuan;Cao Wei;Zhou Qi;Wang Yuecong;Wang Jun;Chen Yuanming(Zhuhai Dynamic Technology Optical Industry Co.,Ltd.,Zhuhai 519055,China;College of Polymer Science and Engineering,Sichuan University,Chengdu 610065,China;School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,China;Sichuan Heentai Semiconductor Co.,Ltd.,Suining 629019,China)
出处
《电镀与精饰》
北大核心
2025年第10期1-10,共10页
Plating & Finishing
基金
珠海市产学研合作项目(2220004002678)
四川省科技项目(2022SNZY002)。
关键词
单晶铜
焊料
生长动力学
金属间化合物
界面反应
monocrystalline copper
solder
growth kinetics
intermetallic compound
interface reactions
