摘要
针对毫米波雷达用高频电路板的聚四氟乙烯(PTFE)与高频纯胶基材在加工过程中出现的钻孔难题,本文采用UV+CO2激光盲孔加工技术,结合等离子体活化处理,得到大小均一、孔底无残胶的孔壁结构;通过结合黑影与电镀工艺,使孔金属化层厚度均匀性满足高频信号传输稳定性要求。实验表明,该方案成功解决了多层PTFE电路板在激光钻孔、孔壁金属化等核心工艺瓶颈,为高频通信及雷达系统的高频电路集成提供参考方案。
To address the processing challenges of PTFE/high-frequency adhesive-based substrates for millimeter-wave radar high-frequency printed circuit boards(PCBs),this study used UV+CO2 laser blind hole drilling technology combined with plasma activation treatment achieves uniform hole walls with minimal residue.Furthermore,a hybrid black-etching and electroplating process ensures thickness uniformity of the hole wall metallization layer,meeting the stability requirements for high-frequency signal transmission.Experimental validation demonstrates that this approach effectively resolves critical manufacturing bottlenecks,including laser drilling precision and metallization integrity,providing a reliable solution for high-frequency communication and automotive radar systems requiring high-frequency circuit integration.
作者
刘意
李朋松
赵城
李沐荣
潘丽
黄双武
Liu Yi;Li Pengsong;Zhao Cheng;Li Murong;Pan Li;Huang Shuangwu
出处
《印制电路资讯》
2025年第5期60-64,共5页
Printed Circuit Board Information
关键词
聚四氟乙烯
高频纯胶
激光钻孔
PTFE
High-frequency pure adhesive
Laser drilling
