摘要
GIS设备的温升特性直接关系到其运行稳定性和使用寿命,弹簧触头作为GIS母线连接的关键部件,其温升受多种因素影响。故以某型号330 kV GIS母线弹簧触头结构为例,开展温升特性试验,分析弹簧圈数、弹簧断裂及弹簧老化对稳态温升的影响,并利用有限元仿真验证试验结果。研究发现,弹簧圈数减少会导致触头温升升高;弹簧断裂对温升影响较为复杂,与触头支撑特性和电流分布密切相关;弹簧老化则会降低导热能力,使温升略有增加;短期温升试验不会对导体内壁与导向套间隙和弹簧压缩量产生影响。仿真计算结果与试验数据误差不超过2.1%,表明仿真模型的可靠性。研究结果可为GIS弹簧触头的运行维护及技术监督提供参考。
The thermal behavior of GIS equipment directly impacts operational stability and service life.As a critical component for busbar connections in GIS,the temperature rise of spring-loaded contacts is influenced by multiple interdependent factors.Based on the technical specifications of a 330 kV GIS busbar spring-contact structure,temperature rise characteristics tests were conducted to analyze the effects of spring coil count,spring fracture,and spring aging on steady-state temperature rise,with experimental results validated through finite element simulation.Based on research findings:Reduced coil turns lead to increased temperature rise of electrical contacts;Spring fracture exerts complex effects on temperature rise,closely correlated with contact support characteristics and current distribution;Spring aging deteriorates thermal conductivity,resulting in a marginal temperature rise increase;Short-duration temperature rise tests do not affect the clearance between the conductor inner wall and the guide sleeve,nor the spring compression.Based on rigorous verification,the simulation results deviate from experimental data within a 2.1%tolerance threshold,demonstrating the high reliability of the simulation model.These findings provide valuable references for operational maintenance and technical oversight of GIS spring finger contacts.
作者
马永福
张国辉
任继云
杨潇洁
王子乐
梁笑晗
MA Yongfu;ZHANG Guohui;REN Jiyun;YANG Xiaojie;WANG Zile;LIANG Xiaohan(Electric Power Research Institute,State Grid Qinghai Electric Power Company,Xining 810008,Qinghai,China;Xi'an Haiwei Electrical Technology Co.,Ltd.Xi'an 710049,Shaanxi,China)
出处
《青海电力》
2025年第3期63-68,82,共7页
Qinghai Electric Power
基金
国网青海省电力公司科技项目(No.522807240002)。
关键词
GIS母线
弹簧触头
温升试验
有限元仿真
GIS busbar
spring contact finger
temperature rise test
finite element analysis(FEA)
