摘要
The effect of Cl^(–)and SO_(4)^(2–)on corrosion behavior of pure copper in simulated groundwater was investigated by electrochemical testing techniques,scanning electron microscope/energy dispersive spectroscopy,X-ray photoelectron spectroscopy,and X-ray diffraction in 0.1 mol/L NaHCO_(3)solutions.The results indicate that increasing Cl^(-)and SO_(4)^(2–)reduces the corrosion resistance of Cu.Cl^(-)and SO_(4)^(2–)can promote anodic dissolution of Cu and deteriorate the passivation property.The breakdown potential(Eb)of Cu decreases with the increase in Cl^(-)and SO_(4)^(2–).With the increase in immersion time,the polarization resistance in different solutions tends to be stable.After 55 days,polarization resistance(Rp)was almost equal in 0 and 0.01 mol/L Cl^(-)and SO_(4)^(2–)solutions.In 0.05 mol/L Cl^(-)and SO_(4)^(2−)solution,Rp was lower.HCO3–has a certain corrosion effect on Cu and the pits size increased with the increase in Cl^(-)and SO_(4)^(2–).The corrosion products(Cu_(2)(OH)_(2)CO_(3))and CuO were detected in solutions without or at low Cl^(-)and SO_(4)^(2–)contents.The corrosion product after immersion in the solution containing 0.05 mol/L Cl^(-)and SO_(4)^(2–)was Cu_(2)O.
基金
supported by the National Natural Science Foundation of China(No.U22B2065).
