摘要
采用二次熔融方法制得高软化点的空心玻璃微珠(HGM),并将其作为填料添加到环氧改性硅树脂中制得防热材料,研究了HGM对防热材料密度、拉伸性能、耐热性能的影响,并对比了高软化点HGM与常规HGM对防热材料性能影响的区别。结果表明,相比常规HGM,高软化点HGM的利特尔顿软化点提升了25.3℃,20 MPa下的破碎率降低了20.5%,密度和熔化温度保持稳定;向环氧改性硅树脂中适量添加HGM可以改善防热材料的性能,降低防热材料的密度、断裂伸长率,提高拉伸强度和耐热性能,且采用高软化点HGM时改善效果更显著。
The hollow glass microspheres(HGM)with high softening point were synthesized by double melting method and incorporated as fillers into epoxy-modified silicone resin to prepare heat-resistant materials.The effects of HGM on the density,tensile properties and heat resistance of the material were studied,and the differences between high softening point HGM and conventional HGM on the properties of the heat resistant material were compared.The results show that compared to the conventional HGM,the high softening point HGM increase the Littleton softening point by 25.3℃,the crushing rate at 20 MPa decrease by 20.5%,and the density and melting temperature remain stable.Adding HGM to epoxy modified silicone resin can improve the performance of heat resistant material,reduce the density and elongation at break,and improve the tensile strength and heat resistance,and the enhancement is more pronounce when using HGM with a higher softening point.
作者
杨家祥
陈伟
彭丽芬
柳雷
YANG Jiaxiang;CHEN Wei;PENG Lifen;LIU Lei(Sinosteel Ma'anshan New Materials Technology Co.,Ltd.,Ma'anshan 243000,China;Anhui University of Technology,Ma'anshan 243000,China)
出处
《有机硅材料》
2025年第5期21-24,59,共5页
Silicone Material
基金
山东省高等学校青年创新科技支撑计划(2023KJ305)。
关键词
空心玻璃微珠
环氧改性硅树脂
软化点
密度
防热
hollow glass microsphere
epoxy modified silicone resin
softening point
density
