摘要
采用CaO-La_(2)O_(3)-B_(2)O_(3)玻璃与Al_(2)O_(3)陶瓷共烧,制备了CaO-La_(2)O_(3)-B_(2)O_(3)+Al_(2)O_(3)系的LTCC复相陶瓷材料,通过X射线衍射(XRD)、扫描电子显微镜(SEM)、差热分析(DTA)以及电性能测试等手段对复相陶瓷的晶体结构、微观形貌、烧结致密化过程以及介电性能进行了表征分析。结果表明,CaO-La_(2)O_(3)-B_(2)O_(3)玻璃在烧结时析晶生成LaBO3相,又与Al_(2)O_(3)发生固相反应生成CaAl_(2)B_(2)O_(7)相,提升玻璃中CaO含量以及降低玻璃粒度都能使得玻璃的ΔT增大,烧结区间扩大,从而使复相陶瓷获得最优异的综合性能。当CaO-La_(2)O_(3)-B_(2)O_(3)中CaO质量分数为15%且粒度为2.5μm时,与质量分数55%的Al_(2)O_(3)复合后可在850℃烧结致密。该材料介电常数约为7.0(20 GHz),介电损耗<0.0009(20 GHz),抗弯强度>240 MPa。通过此组分流延制备出的LTCC生瓷带与银导体共烧,基板翘曲度≤3‰,满足LTCC基板材料对陶瓷基本特性及与银导体共烧匹配的应用需求。
LTCC composite ceramics of the CaO-La_(2)O_(3)-B_(2)O_(3)/Al_(2)O_(3) system were fabricated by co-firing glass and ceramic powders.The crystal structure,microstructure,sintering densification process,and dielectric properties of the composite were characterized and analyzed utilizing X-ray diffraction(XRD),scanning electron microscopy(SEM),differential thermal analysis(DTA),and electrical performance testing methods.Experimental results demonstrate that,during the sintering process,the CaO-La_(2)O_(3)-B_(2)O_(3) glass crystallized into LaBO_(3) phase,and formed CaAl_(2)B_(2)O_(7) phase by reacting with Al_(2)O_(3) via solid-state reaction.The ΔT of the glass can be enlarged by increasing the CaO content in the glass and reducing the glass particle size,thereby expanding the sintering window and achieving optimal comprehensive performance for the composite ceramic.At the CaO content of 15%and particle size of 2.5μm in the CaO-La_(2)O_(3)-B_(2)O_(3) system,the maximum density can be achieved by co-firing with 55% Al_(2)O_(3) at 850℃.The composite ceramic exhibits a desirable dielectric constant of 7.0(20 GHz),dielectric loss of<0.0009(20 GHz),and flexural strength of>240 MPa.The LTCC green tapes were prepared by tape casting and co-fired with a silver conductor.A warpage of the substrate was≤3‰,meeting the application requirements for the LTCC substrate materials in terms of basic ceramic properties and compatibility with co-firing of silver conductor.
作者
吕洋
马涛
沐方清
兰耀海
周万丰
LYU Yang;MA Tao;MU Fangqing;LAN Yaohai;ZHOU Wanfeng(The 43rdResearch Institute of China Electronics Technology Group Corporation,Hefei230088,China;Anhui Province Key Laboratory of Microsystem,The 43rd Research Institute of China Electronics Technology Group Corporation,Hefei230088,China)
出处
《电子元件与材料》
北大核心
2025年第6期655-661,共7页
Electronic Components And Materials
基金
安徽省科技攻坚计划项目(202423i08050005)。
